发明名称 CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, MULTILAYER BOARD, AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a flexible multilayer printed wiring board which can securely realize interlayer connection, has high reliability and can laminate an outer-layer circuit board. SOLUTION: The outer-layer both side circuit boards 120 are joined on both surfaces of an inner-layer flexible circuit board 220 having an adhesive layer 209 having flux function on its both surface sides, and the boards 120 each provided with a conductive post 109 are joined on the board 220. Predetermined portions of conductor circuits (conductor circuits) 104, 204 of the wiring boards 220, 120 are electrically connected via the conductor post 109. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005038951(A) 申请公布日期 2005.02.10
申请号 JP20030198168 申请日期 2003.07.17
申请人 SUMITOMO BAKELITE CO LTD 发明人 KONDO MASAYOSHI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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