发明名称 |
MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND ITS PRODUCTION |
摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer flexible printed wiring board having interlayer connection which is excellent in connection reliability, the best for microfabrication of a wiring layer and superior in productivity; and to provide its production. SOLUTION: The multilayer flexible printed wiring board is so constituted that conductor filled in a hole formed in thickness direction of an insulating layer which connects electrically a part between wiring layers formed on both sides of the insulating layer. The wiring board consists of configuration containing copper core solder balls having copper balls being included in a core inside the conductor. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005038918(A) |
申请公布日期 |
2005.02.10 |
申请号 |
JP20030197577 |
申请日期 |
2003.07.16 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
YOSHINO TOYOICHI;NAKAJIMA KOJI |
分类号 |
H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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