发明名称 MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND ITS PRODUCTION
摘要 PROBLEM TO BE SOLVED: To provide a multilayer flexible printed wiring board having interlayer connection which is excellent in connection reliability, the best for microfabrication of a wiring layer and superior in productivity; and to provide its production. SOLUTION: The multilayer flexible printed wiring board is so constituted that conductor filled in a hole formed in thickness direction of an insulating layer which connects electrically a part between wiring layers formed on both sides of the insulating layer. The wiring board consists of configuration containing copper core solder balls having copper balls being included in a core inside the conductor. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005038918(A) 申请公布日期 2005.02.10
申请号 JP20030197577 申请日期 2003.07.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YOSHINO TOYOICHI;NAKAJIMA KOJI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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