| 摘要 |
PROBLEM TO BE SOLVED: To provide a porous organic film-forming composition capable of giving an electrical insulating film having a low relative dielectric constant and excellent mechanical strengths, to provide a porous organic film having the low relative dielectric constant and the excellent mechanical strengths, and to provide a method for producing the same. SOLUTION: This porous organic film-forming composition contains a component (A) expressed by formula (1) (X<SP>1</SP>is a 2-6C alkenyl, a 2-6C alkynyl or a monovalent organic group; X<SP>2</SP>is H, a halogen, hydroxy, a 1-6C alkyl, a 1-6C alkoxy, phenoxy or an aryl which may be substituted; n is an integer of 2 to 16; and m=16-n) and a component (B) comprising a thermally evaporating compound and/or a thermally decomposing polymer. The method for producing the porous organic film includes processes for applying the composition to a base plate and heat-treating the applied film thereafter. The porous organic film is obtained by the method. COPYRIGHT: (C)2005,JPO&NCIPI
|
