| 摘要 |
Methods of providing foamed polynorbomene insulating material for use with an integrated circuit device, as well as apparatus and systems making use of such foamed polynorbomene insulating materials. The methods include forming a layer of polynorbomene material and converting at least a portion of the layer of polynorbomene material to a foamed polynorbomene material, such as by exposing the layer of polynorbomene material to a supercritical fluid. The foamed polynorbomene material can provide electrical insulation between conductive layers of the integrated circuit device. |
