| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for efficiently adhering two substrates. SOLUTION: A wafer loaded and held on a holding table 7 with an adhesive sheet bonded on its surface is bonded on the surface of a substrate for reinforcing held by a center and side locking claws 8, 9 so as to face close to the wafer by rolling the bonding roller. The both locking claws 8, 9 rock down and the claws themselves descend with the rolling of the bonding roller to keep the bending of the reinforcing substrate to approximately constant, and the bonding roller rolls back when it approaches the claws 8, 9. COPYRIGHT: (C)2005,JPO&NCIPI |
