发明名称 NEGATIVE PHOTORESIST COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a negative photoresist composition with which good resolution is obtained in a pattern forming method in which an underlayer film is disposed on a substrate, a photoresist film comprising a negative photoresist composition is disposed on the underlayer film, and after selectively exposing the photoresist film, the underlayer film and the photoresist film are simultaneously developed. <P>SOLUTION: The negative photoresist composition contains (A) an alkali-soluble resin, (B) an acid generator which generates an acid upon irradiation with a radiation and (C) a crosslinking agent, wherein the acid generator (B) comprises an onium salt whose cation has no hydrophilic group. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005037414(A) 申请公布日期 2005.02.10
申请号 JP20030162060 申请日期 2003.06.06
申请人 TOKYO OHKA KOGYO CO LTD 发明人 HIROSAKI TAKAKO;NIIHORI HIROSHI
分类号 G03F7/004;G03F7/038;G03F7/11;G11B5/31;G11B5/39 主分类号 G03F7/004
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