WAFER SUBSTRATE FOR SHEET SUBSTRATE STRUCTURE FORMATION, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING MEMS ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a wafer substrate for sheet substrate structure formation having a feed through structure suitable for a large aperture wafer process, a method for manufacturing the wafer substrate, and a method for manufacturing an MEMS(Micro-Electro-Mechanical-Systems) element. SOLUTION: This substrate to be used for a wafer process is structured by integrally adhering a main body substrate wafer through an adhesive layer to an auxiliary supporting substrate wafer, and the surface side of the main body substrate wafer is formed with holes and areas where the holes are buried with conductive materials, and the wafer substrate is used for thinning as a wafer substrate for sheet substrate structure formation having a feed through area. This substrate wafer is adhered to another substrate wafer so that an element can be formed in a wafer level. COPYRIGHT: (C)2005,JPO&NCIPI