| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type capacitor and its manufacturing method capable of forming a solder fillet essential for a stabilization in packaging posture of a product without adding a complex manufacturing process and having a high margin in manufacturing tolerance, and to provide a lead frame used for the capacitor. SOLUTION: The chip type capacitor is armored by a armoring resin 1 with a part of an electrode terminal 5 connected to a capacitor element 2 from which an anode lead wire 3 is taken out and a cathode terminal 6 exposed to a substrate packaging surface and the surface of a product. The product side face is formed by cutting, and a side surface as an exposed surface of the anode terminal 5 to a side surface of the product comprises a plating surface 8 and a cutting surface 14. The side surface of the cathode terminal 6 also comprises a surface having a plating, and the cutting surface. COPYRIGHT: (C)2005,JPO&NCIPI
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