发明名称 POLYOXYMETHYLENE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyoxymethylene resin composition which has a very high thermal stability, prevents not only the occurrence of mold deposit in a metal mold but also the occurrence of mold deposit during molding after long-term storage, and has an excellent external appearance with little foreign matter. SOLUTION: The polyoxymethylene resin composition is prepared by compounding (A) 100 pts.wt. polyoxymethylene resin with (B) 0.01-10 pts.wt. melamine and (C) 0.01-10 pts.wt. compound having an amino-group-containing triazine structure. The compound (C) is a condensate of formaldehyde and an amino-group-containing triazine compound and/or is a derivative formed by alkylating the whole or a part of methylol groups bonded to amino groups of the condensate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005036040(A) 申请公布日期 2005.02.10
申请号 JP20030197743 申请日期 2003.07.16
申请人 TORAY IND INC;KTP:KK 发明人 ITO GENMEI;NISHIMURA TORU;HIDAKA SHINSUKE;TOKIMINE KUNIO;KIN FUKUSHU
分类号 C08L59/00;C08K5/3492;(IPC1-7):C08L59/00;C08K5/349 主分类号 C08L59/00
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