| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable an outer periphery polishing device that polishes the outer periphery of the flat surface of a semiconductor wafer provided with an orientation flat to accurately polish the whole circumference of outer periphery of the flat surface of the wafer including the portion of the orientation flat, to eliminate the need of complicated control to reduce the price of the device, and to easily maintain accuracy. <P>SOLUTION: The outer periphery polishing device 1 is provided with a wafer table unit 2, an X-axis transfer device 6X, and a Y-axis transfer device 6Y. The liner portion of the outer periphery of the flat surface of the orientation flat is only polished by the linear motion of the X-axis transfer device 6X and the outer periphery of the flat surface of an arcuate section is only polished by the revolving motion of the wafer table unit 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
