| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device adapted to join a dielectric substratum and a resin covering member firmly to make complete sealing of a semiconductor element using the resin covering member to enable a long-term stable operation of the semiconductor element, and also to provide a method of fabricating the semiconductor device. <P>SOLUTION: The method of fabricating the semiconductor device comprises steps of mounting a semiconductor element 3 on a dielectric substratum 1; covering the top surface of the dielectric substratum 1 inclusive of the semiconductor element 3 with a resin covering member 4, wherein the side surfaces of the dielectric substratum 1 have notches 1b with internal surfaces formed in a concave curve; and fitting the resin covering member 4 into the notches 1b to effect the joining. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
