SEMICONDUCTOR CHIP BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve the productivity in a semiconductor chip built-in wiring board wherein a semiconductor chip is built in a substrate and its manufacturing method.

SOLUTION: The semiconductor chip built-in wiring board is provided with a semiconductor chip 13, a single insulation layer 10 surrounding at least the side surface of the semiconductor chip 13, first and second wiring layers 23 and 32 that are provided on and under the insulation layer 10 respectively, a conductor 15 that electrically connects an input/output pad with a wiring pattern 23 in a wiring layer 23 (the first wiring layer) on a surface where the input/output pad of the semiconductor chip 13 is provided in the first and second wiring layers 23 and 32, and a conductive interlayer connector 35 that is provided in a direction penetrating the insulation layer 10.

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