| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module where an insulating substrate is adhered between a semiconductor chip and a heat insulating board which radiates heat from the semiconductor chip by soldering for preventing the deformation of the heat insulating board, and for preventing the generation of any clearance between a cooler and the semiconductor module. SOLUTION: An insulating substrate is connected between a semiconductor chip and a heat insulating board which radiates heat from the semiconductor chip by soldering, and the insulating substrate and the semiconductor chip are coated with a case body as a whole, and the case body is fixed to the heat insulating board so that a semiconductor module can be constituted. The face of the heat insulating board to which the insulating board connected by soldering is formed as an almost plane face, and the outside face of the case body is shaped so as to be expanded. COPYRIGHT: (C)2005,JPO&NCIPI |
