| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a built-up multilayer printed circuit board, with which cutting work can easily be performed along almost the center line of a blind via hole at the time of performing cutting work from a base land forming-side of the blind via hole made in the built-up multilayer printed circuit board. SOLUTION: A non-through hole for the reference mark finally becomes a reference conduction through hole at the time of the cutting work, or a through hole is formed at the same time as a non-through hole for blind via hole by laser beam machining. COPYRIGHT: (C)2005,JPO&NCIPI |
