| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board on which fine wiring can be formed easily and a circuit pattern higher in density than before can be formed without requiring any plated lead for lines and through holes, and which can prevent the deterioration of connection reliability by holding the fluctuated accuracy of the height of a circuit at a high level. SOLUTION: The method of manufacturing the wiring board includes a step (a) of forming a hole which becomes a through hole in a copper-plated laminated board, a step (b) of forming an electroplating or electroless plating accepting layer on the internal wall of the hole, and a step (c) of selectively applying a plating resist to the laminated board except the hole and its circumference. The method also includes a step (d) of forming a plated nickel or nickel alloy layer on at least the internal wall of the hole by electroplating or electroless plating, a step (e) of peeling the plating resist, and a step (f) of protecting the plated layer formed on the internal wall of the through hole and, at the same time, forming a etching resist for forming wiring having no through hole for plated lead. In addition, the method also includes a step (g) of selectively etching off copper foil sections on which the etching resist is not formed. COPYRIGHT: (C)2005,JPO&NCIPI
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