| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating apparatus for an electronic component which, even for a electronic component having a very small outside dimension and in very small shape, dispenses with charging of of media, enables the structure thereof to be miniaturized and simplified, and secures a desired plating film at an almost uniform thickness in a short period of time. SOLUTION: In a plating tank 8 fitted with an anode 6, a plating drum 20 is provided on the lower end of a driving shaft 5 so as to be rotationally driven. The plating drum is provided with: an insulated ring 22 whose inside wall is fitted with a cathode ring 24; a bottom part insulating plate 23 sealing the bottom of the insulated ring; and an upper insulating plate 21 fixed to the upper side of the insulated ring. Then, the upper insulating plate is provided with a first through hole 21a and a second through hole 21b so that a plating liquid flows out from the inside of the plating drum to the outside, and further, flows from the outside to the inside by centrifugal force acting when the plating drum is rotationally driven. COPYRIGHT: (C)2005,JPO&NCIPI
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