SEMICONDUCTOR ENCAPSULATION MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor encapsulation material which achieves a good heat resistance for its cured material and has an excellent moldability with an improved flowability. SOLUTION: This semiconductor encapsulation material has an epoxy resin (A), a hardener (B) and an inorganic filler (C) as its essential components. The epoxy resin (A) is a reaction product of an epihalohydrin and a compound having a structure obtained by a polyaddition reaction between an unsaturated alicyclic compound and a phenol. The epoxy resin (A) contains 0.1-2.0 wt% of a material having a polystyrene conversion number average molecular weight by gel permeation chromatography of 100-220. COPYRIGHT: (C)2005,JPO&NCIPI