发明名称 Resin composition
摘要 The invention relates to a composition compriseing an at least bifunctional acidic prepolymer (A) curable under the action of heat an compound of the formula (I) in which A is a mono- to tetravalent, saturated or unsaturated alkyl group having 1 to 60 carbon atoms, a mono- to tetravalent aryl group, a mono- or diaiylamino group having 1 to 4 carbon atoms, an alkenylene group having 2 to 4 carbon atoms, a carboxyalkylene group or an alkoxycarbonylalkylene group having 1 to 4 carbon atoms, n is 1 or 2, m is 2-n, q is a number from 0 to 3, R<1 >is hydrogen or an alkyl group having 1 to 5 carbon atoms or a hydroxyalkyl group having 1 to 5 carbon atoms and X is a radical of the formula in which R<3 >and R<4 >are identical or different and, independently of one another, are hydrogen, a straight-chain or branched alkyl group or hydroxyalkyl group having 1 to 5 carbon atoms, or R<3 >and R<4>, together with the carbon atom to which they are bonded, form a cycloaliphatic ring. The composition is suitable for the production of printed circuits.
申请公布号 US2005032946(A1) 申请公布日期 2005.02.10
申请号 US20040498032 申请日期 2004.10.07
申请人 HUNTSMAN ADVANCED MATERIALS AMERICAS, INC. 发明人 SALVIN ROGER PIERRE-ELIE;MARCHESINI ALESSANDRO;HOSHINO MASATO
分类号 G03F7/004;B32B27/26;C08F287/00;C08F290/06;C08G85/00;C08L51/00;C08L53/00;G03F7/027;G03F7/033;G03F7/038;H05K3/28;(IPC1-7):C08L1/00 主分类号 G03F7/004
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