| 摘要 |
The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive agent layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive agent layer, the intermediate layer having a storage elastic modulus (G') of 3.0x10<4 >to 1.0x10<8 >Pa at 23° C. and a storage elastic modulus (G') of 1.0x10<3 >to 8.0x10<4 >Pa at 200° C. Even when this re-peelable pressure-sensitive adhesive sheet and a semiconductor wafer are adhered to each other and they are placed, as they are, in a heating environment, the wafer can be prevented from being warped.
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