发明名称 Solid-state image sensing device, manufacturing method and attachment method thereof, imaging apparatus and image read unit for imaging apparatus
摘要 A solid-state image sensing device is provided which saves the effort of removing adhesives from a cover glass and is capable of reading an image without being affected by adhesive residuals. In a solid-state image sensing device, defacement of a cover glass upon the transport, etc. is prevented by having a protective film adhere to the surface of the cover glass. The adhesion section between the cover glass and the protective film is provided so as to keep clear of the front face of a light-receiving section. Therefore, after the protective film is detached, even without conventional surface processing like cleaning the cover glass, the light received by the light-receiving section entering through the cover glass is not adversely affected by residual adhesives.
申请公布号 US2005029612(A1) 申请公布日期 2005.02.10
申请号 US20040876513 申请日期 2004.06.28
申请人 BROTHER KOGYO KABUSHIKI KAISHA 发明人 NAGASAKA HIDEAKI;OSAKABE YOSHINORI
分类号 H01L27/14;H01L23/02;H01L31/0203;H04N5/335;(IPC1-7):H01L21/00;H01L31/023 主分类号 H01L27/14
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