发明名称 LED casing structure for a photoelectric semiconductor e.g. in flashlight, has an embedded injection-molded element, an LED chip and a lens to act as a focusing point
摘要 <p>An LED casing structure (1a) has an embedded injection-molded element (10a) with little legs (11a) glued onto a plinth's (50a) bowl (40a) together with an LED chip (20a) by means of a heat-conducting metal/silicon platelet (30a). A lens (12a) acts as a focusing point and reduces loss of light.</p>
申请公布号 DE202004016256(U1) 申请公布日期 2005.02.10
申请号 DE20042016256U 申请日期 2004.10.21
申请人 HARVATEK CORP., HSIN CHU 发明人
分类号 B81C3/00;H01L31/02;H01L31/04;H01L33/48;H01L33/58;H01L33/64;(IPC1-7):H01L33/00 主分类号 B81C3/00
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