发明名称 PRINTED-WIRING BOARD AND METHOD OF PRODUCING THE SAME
摘要 <p>A printed-wiring board capable of preventing occurrence of short-circuit is provided. A printed-wiring board (100) comprises a via land (2A), a glass epoxy resin layer (3), a via conductor (6), and a block layer (4A). The via land (2A) is formed on a core layer (1). The glass epoxy resin layer (3) is formed on the core layer (1) and via land (2A). The via conductor (6) is formed on the via land (2A). The block layer (4A) is formed on the via land (2A) and between the via conductor (6) and glass epoxy resin layer (3).</p>
申请公布号 WO2005013653(A1) 申请公布日期 2005.02.10
申请号 WO2004JP09529 申请日期 2004.07.05
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;MORI, HIROYUKI;YAMANAKA, KIMIHIRO;KODAMA, YASUSHI 发明人 MORI, HIROYUKI;YAMANAKA, KIMIHIRO;KODAMA, YASUSHI
分类号 H05K1/03;H05K3/42;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/03
代理机构 代理人
主权项
地址