| 摘要 |
PROBLEM TO BE SOLVED: To increase a heat radiating effect without lowering a reliability. SOLUTION: A semiconductor chip 3 is joined to a collector side copper circuit pattern 1 through a solder joined part 2. Further, the upper surface of the semiconductor chip 3 is connected to a forked lead frame 7 joined by branching to a first emitter side copper circuit pattern 5a and a second emitter side copper circuit pattern 5b through a solder joined part 4. Heat generated from the semiconductor chip 3 is radiated from the collector side copper circuit pattern 1 on the back of the chip, and also the heat transmits on each path of the forked lead frame 7 to the first emitter side copper circuit pattern 5a and the second emitter side copper circuit pattern 5b for radiation of heat. COPYRIGHT: (C)2005,JPO&NCIPI |
