| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring substrate which is capable of suppressing the generation of burrs without changing the shape, material or the like of a die, and the wiring substrate. SOLUTION: The wiring glass epoxy substrate 15, on which punching work is applied by the die 50, comprises a glass epoxy substrate 15, a wiring pattern 16 provided on the glass epoxy substrate 15, and a solder resist 19 provided on the glass epoxy substrate 15 so as to cover the wiring pattern 16. A bridging part 17 punched out by the die 50 is exposed from the lower part of the solder resist 19. When a sheet wiring substrate 100 is punched out using the die 50, the die 50 can be pushed directly against the bridging part 17, and the bridging part 17 can be punched out with a reduced stress. COPYRIGHT: (C)2005,JPO&NCIPI
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