| 摘要 |
PROBLEM TO BE SOLVED: To provide a frame transfer prober capable of preventing chips, probe card needles, etc. from being damaged by previously detecting the peeling of the chips from a tape for dicing. SOLUTION: The frame transfer prober 1 for inspecting electrical characteristics of a large number of semiconductor chips 10 fixed to the tape 11 for dicing is provided with a peeling detection means 9 for detecting the peeling or ejection of the chips from the tape. The peeling detection means comprises a light emitting part 91 for emitting laser light L; a light receiving part 92; and a determining part 93 for determining the peeling and protrusion of the chips on the basis of increase or reduction in the quantity of received light. COPYRIGHT: (C)2005,JPO&NCIPI
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