| 发明名称 |
FURTHER METHOD TO PATTERN A SUBSTRATE |
| 摘要 |
<p>The present invention relates to methods for patterning substrates, such as reticles, masks or wafers, which reduce critical dimension variations, improving CD uniformity. In particular, it relates to tuning doses applied in passes of a multipasss writing strategy to measurable characteristics of resists or radiation sensitive layers applied to the substrates. Particular writing strategies are described. Aspects of the present invention are described in the claims, specification and drawings.</p> |
| 申请公布号 |
WO2005013007(A1) |
申请公布日期 |
2005.02.10 |
| 申请号 |
WO2004SE01161 |
申请日期 |
2004.08.04 |
| 申请人 |
MICRONIC LASER SYSTEMS AB;WALFORD, JONATHAN;ASKEBJER, PER;EKLUND, ROBERT;FOSSHAUG, HANS |
发明人 |
WALFORD, JONATHAN;ASKEBJER, PER;EKLUND, ROBERT;FOSSHAUG, HANS |
| 分类号 |
G03C5/00;G03F7/20;(IPC1-7):G03F7/20 |
主分类号 |
G03C5/00 |
| 代理机构 |
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