ТЕРМОЭЛЕКТРИЧЕСКИЙ ТЕПЛООТВОД

摘要

FIELD: cooling and heat-transfer systems for computer processors. ^ SUBSTANCE: proposed heat sink is assembled of thermal modules. Heat sink basic module is its base. Needle-type stems of heat sink are disposed on base in staggered or in-line manner. Each stem has two or three additional concatenated thermal modules. Surface area of the latter is much smaller than that of base thermal module. Hot junctions of top thermal modules of each stem are protruded through certain distance forward relative to heat-liberating piece of equipment. ^ EFFECT: enhanced quality of heating and heat-transfer process. ^ 1 cl, 2 dwg