| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily and efficiently remove resin residing in the manifold of a T-die. SOLUTION: This T-die with deckles consists of a molding die main body 1 which has a manifold 2 for storing a molten resin formed in the longitudinal direction and discharges the molten resin from an opening formed at the lower end of the manifold 2, a pair of deckles 7 inserted airtightly into the manifold 2 from both ends in freely sliding manner and a pair of side plates 6 which close both ends of molding die main body 1 and have the deckles 7 inserted through the side plates 6. Further, the T-die is equipped with a drawing mechanism 34 which draws the deckles 7 to the outside of the side plates 6 in the longitudinal direction of the deckles respectively and a transfer mechanism 60 which transfers the deckles 7 drawn to the outside of the side plates 6 together with the drawing mechanism 34 and thereby exposes the end face of the manifold 2.</p> |
