发明名称 |
Workpiece carrier and polishing apparatus having workpiece carrier |
摘要 |
A workpiece carrier holds a workpiece such as a semiconductor wafer and presses the workpiece against a polishing surface on a polishing table. The workpiece carrier has a top ring body for holding the workpiece, and a retainer ring for holding an outer circumferential edge of the workpiece. A fluid chamber which is supplied with a pressurized fluid such as a compressed air is provided in the top ring body and covered by a resilient membrane. A plurality of pressing members are fixed to the resilient membrane for applying a pressing force through the resilient membrane to the workpiece under the pressure of the fluid in the fluid chamber. <IMAGE> |
申请公布号 |
EP1101566(B1) |
申请公布日期 |
2005.02.09 |
申请号 |
EP20000125012 |
申请日期 |
2000.11.16 |
申请人 |
EBARA CORPORATION |
发明人 |
KIMURA, NORIO;YASUDA, HOZUMI |
分类号 |
B24B37/005;B24B37/04;B24B37/30;B24B37/32;H01L21/304;(IPC1-7):B24B37/04;B24B41/06 |
主分类号 |
B24B37/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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