Circuit module and manufacturing method thereof

摘要

A circuit module includes an electronic component (30), a ceramic multilayer substrate (10) and a resin wiring substrate (70). The ceramic multilayer substrate (10) is provided with a wiring layer (18) disposed on top thereof and a cavity (22) in which the electronic component (30) is mounted, wherein a space between the electronic component (30) and the cavity (22) is filled with a thermosetting resin (40) and a surface of the filled cavity (22) is planarized. The resin wiring substrate (70) has an insulating adhesive layer (52) disposed at one side thereof and provided with at least one opening filled with a conductive resin (56). The ceramic multilayer substrate (10) and the resin wiring substrate (70) are bonded by the insulating adhesive layer (52), and the wiring layer (18) on the ceramic multilayer substrate (10) is electrically connected with the conductive resin (56).