发明名称 Ground connecting apparatus for the foldable mobile terminal
摘要 <p>Disclosed is a ground connecting apparatus for a mobile terminal, in which grounds formed on the terminal are directly or indirectly connected so as to reduce an SAR value, thereby adjusting a connection length of the grounds. The ground connecting apparatus for a folder-type mobile terminal, which has a main body including a main body-side ground, a folder including a folder-side ground, a hinge unit and a hinge module, includes a hinge shaft connected to one end of the hinge module; a hinge contact means installed at a designated position on the first PCB so that the hinge contact means is connected to a first PCB-side ground connecting pad provided on the first PCB and adjusts an electrical connection length of the grounds; a pin connector installed at the other end of the hinge module; and a hinge connecting means installed at the pin connector so that the hinge connecting means is connected to a second PCB-side ground connecting pad provided on the second PCB and adjusts the electrical connection length of the grounds.</p>
申请公布号 EP1505800(A2) 申请公布日期 2005.02.09
申请号 EP20040018736 申请日期 2004.08.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, SEON-KYENG;CHOI, WAN-JIN;LEE, JU-HYUNG;PARK, JUNG-HO
分类号 E05D11/00;H01Q1/02;H01Q1/24;H01Q1/48;H01R13/24;H01R13/66;H01R35/02;H04B1/38;H04M1/02;(IPC1-7):H04M1/02 主分类号 E05D11/00
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