发明名称 |
Ground connecting apparatus for the foldable mobile terminal |
摘要 |
<p>Disclosed is a ground connecting apparatus for a mobile terminal, in which grounds formed on the terminal are directly or indirectly connected so as to reduce an SAR value, thereby adjusting a connection length of the grounds. The ground connecting apparatus for a folder-type mobile terminal, which has a main body including a main body-side ground, a folder including a folder-side ground, a hinge unit and a hinge module, includes a hinge shaft connected to one end of the hinge module; a hinge contact means installed at a designated position on the first PCB so that the hinge contact means is connected to a first PCB-side ground connecting pad provided on the first PCB and adjusts an electrical connection length of the grounds; a pin connector installed at the other end of the hinge module; and a hinge connecting means installed at the pin connector so that the hinge connecting means is connected to a second PCB-side ground connecting pad provided on the second PCB and adjusts the electrical connection length of the grounds.</p> |
申请公布号 |
EP1505800(A2) |
申请公布日期 |
2005.02.09 |
申请号 |
EP20040018736 |
申请日期 |
2004.08.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, SEON-KYENG;CHOI, WAN-JIN;LEE, JU-HYUNG;PARK, JUNG-HO |
分类号 |
E05D11/00;H01Q1/02;H01Q1/24;H01Q1/48;H01R13/24;H01R13/66;H01R35/02;H04B1/38;H04M1/02;(IPC1-7):H04M1/02 |
主分类号 |
E05D11/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|