发明名称 Method of estimating a diamond wafer
摘要 <p>Surfaces of diamond crystals are examined by coating the surfaces with thin metal films, launching laser beams to the diamond surfaces in a slanting angle, detecting defects and particles on the diamond surfaces by the scattering of beams and counting the defects and particles by a laser scanning surface defect detection apparatus. Diamond SAW devices should be made on the diamond films or bulks with the defect density less than 300 particles cm<-2>. Preferably, the diamond surfaces should have roughness less than Ra20nm. Diamond SAW filters can be produced by depositing a piezoelectric film and making interdigital transducers on the low-defect density diamond crystals. <IMAGE></p>
申请公布号 EP0909025(B1) 申请公布日期 2005.02.09
申请号 EP19980308109 申请日期 1998.10.06
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 FUJII, SATOSHI;SEKI, YUICHIRO;YOSHIDA, KENTARO;NAKAHATA, HIDEAKI;HIGAKI, KENJIRO;UEMURA,TOMOKI;KITABAYASHI,HIROYUKI;SHIKATA, SHIN-ICHI
分类号 C30B29/04;C23C14/34;G01N21/47;G01N21/88;H01L41/09;H03H3/08;H03H9/02;H03H9/25;(IPC1-7):H03H9/02 主分类号 C30B29/04
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