发明名称 Tab tape, method of making same and semiconductor device
摘要 A TAB tape has: a tape substrate of insulating material; a first wiring pattern of conductive material, the first wiring pattern being formed on one surface of the tape substrate; a second wiring pattern of conductive material, the second wiring pattern being formed on the other surface of the tape substrate; a conduction part that allows electrical conduction between the first wiring pattern and the second wiring pattern; and a stiffener that is adhered through adhesive to the other surface of the tape substrate. In the TAB tape, the second wiring pattern includes an insulating material filled in a groove region where no wiring pattern is formed around wiring patterns of the second wiring pattern.
申请公布号 US6853065(B2) 申请公布日期 2005.02.08
申请号 US20030647922 申请日期 2003.08.26
申请人 HITACHI CABLE, LTD. 发明人 TANAKA HIROKI;ISHIKAWA HIROSHI;MATSUO NAGAYOSHI
分类号 H01L23/12;H01L21/60;H01L23/13;H01L23/31;H01L23/36;(IPC1-7):H01L23/04 主分类号 H01L23/12
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