发明名称 |
Tab tape, method of making same and semiconductor device |
摘要 |
A TAB tape has: a tape substrate of insulating material; a first wiring pattern of conductive material, the first wiring pattern being formed on one surface of the tape substrate; a second wiring pattern of conductive material, the second wiring pattern being formed on the other surface of the tape substrate; a conduction part that allows electrical conduction between the first wiring pattern and the second wiring pattern; and a stiffener that is adhered through adhesive to the other surface of the tape substrate. In the TAB tape, the second wiring pattern includes an insulating material filled in a groove region where no wiring pattern is formed around wiring patterns of the second wiring pattern.
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申请公布号 |
US6853065(B2) |
申请公布日期 |
2005.02.08 |
申请号 |
US20030647922 |
申请日期 |
2003.08.26 |
申请人 |
HITACHI CABLE, LTD. |
发明人 |
TANAKA HIROKI;ISHIKAWA HIROSHI;MATSUO NAGAYOSHI |
分类号 |
H01L23/12;H01L21/60;H01L23/13;H01L23/31;H01L23/36;(IPC1-7):H01L23/04 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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