Electronic part, an electronic part mounting element and a process for manufacturing such the articles

摘要

A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element.Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 mum or more and to 10.0 mum or less and preferably to 1.0 mum or more and to 5.0 mum or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.