发明名称 |
Semiconductor package using a printed circuit board and a method of manufacturing the same |
摘要 |
A semiconductor package has a substrate comprising a thermosetting resin layer of an approximate planar plate, a plurality of copper patterns formed at top and bottom surfaces of the resin layer, and protective layers coated on predetermined regions of the copper patterns and the thermosetting layer and having a same height at a surface of the resin layer. A semiconductor die is coupled to a center of the top surface of the substrate. A plurality of conductive wires for electrically coupling the semiconductor die to the copper patterns is positioned at the top surface of the resin layer. An encapsulant is used for covering the semiconductor die located at the top surface of the substrate and the conductive wires in order to protect them from the external environment. A plurality of solder balls is coupled to the bottom surface of the substrate.
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申请公布号 |
US6853060(B1) |
申请公布日期 |
2005.02.08 |
申请号 |
US20030420977 |
申请日期 |
2003.04.22 |
申请人 |
AMKOR TECHNOLOGY, INC. |
发明人 |
SEOK JAE WOOK;LEE KYU WON;YOO YONG SUK |
分类号 |
H01L21/48;H01L23/16;H01L23/31;H01L23/498;H05K3/24;H05K3/28;(IPC1-7):H01L23/02;H01L23/04;H01L21/44 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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