发明名称 |
Circuit board, mounting structure for semiconductor device with bumps, and electro-optic device and electronic device |
摘要 |
The present invention provides a circuit board including a plurality of pads for mounting a semiconductor device with bumps and a plurality of wires drawn from the respective pads, a mounting structure for the semiconductor device with bumps, and an electro-optic device and an electronic device. The circuit board has a region where the pitch in the longitudinal direction and the lateral direction of the plurality of pads are different from each other and the wires are preferentially drawn from a wider pitch side of the longitudinal direction or the lateral directions of the pads.
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申请公布号 |
US6853092(B2) |
申请公布日期 |
2005.02.08 |
申请号 |
US20030682357 |
申请日期 |
2003.10.09 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
ASHIDA TAKESHI |
分类号 |
H05K1/18;H01L23/12;H01L23/48;H05K1/11;H05K3/28;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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