发明名称 Close packing LED assembly with versatile interconnect architecture
摘要 A modular mounting assembly (10) for connecting a plurality of LEDs in a selectable electrical and spatial arrangement includes a plurality of substrates (12) each having at least one LED (14a, 14b) fixedly arranged thereon, and a plurality of connectors (16) arranged thereon that are in operative communication with the at least one LED (14a, 14b) fixedly arranged thereon. The plurality of substrates (12) are arranged in a selected spatial arrangement having selected pairs of connectors (16) in operative communication with each other to effectuate electrical connection therebetween, whereby an electrical arrangement of the plurality of LEDs is effectuated. A plurality of interconnecting elements (50A, 50D, 50S, 50P) electrically and structurally interconnect selected spatially adjacent substrates (12) in cooperation with the selected pairs of connectors. A connector (16) has a plurality of electrical conductor members (1, 2, 3, 4, 5), and an interconnecting element (50) has a selected electrical configuration that effectuates a selected interconnection of conductor members (1, 2, 3, 4, 5).
申请公布号 US6851831(B2) 申请公布日期 2005.02.08
申请号 US20020063364 申请日期 2002.04.16
申请人 GELCORE LLC 发明人 KARLICEK, JR. ROBERT F.
分类号 H01R29/00;H05K1/14;(IPC1-7):F21V21/005 主分类号 H01R29/00
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