发明名称 |
Photoresist composition for imaging thick films |
摘要 |
The present invention relates to a light-sensitive photoresist composition especially useful for imaging thick films, comprising a film-forming alkali-soluble resin, a photoactive compound, and a surfactant at a level ranging from about 2000 ppm to about 14,000 ppm by weight of total photoresist. Preferably the photoresist film has a thickness greater than 20 microns. The invention further provides for a process for coating and imaging the light-sensitive composition of this invention.
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申请公布号 |
US6852465(B2) |
申请公布日期 |
2005.02.08 |
申请号 |
US20030393925 |
申请日期 |
2003.03.21 |
申请人 |
CLARIANT INTERNATIONAL LTD. |
发明人 |
DAMMEL RALPH R.;MEYER STEPHEN;SPAK MARK A. |
分类号 |
G03F7/004;G03F7/016;G03F7/022;(IPC1-7):G03F7/023;G03F7/30 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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