SEMICONDUCTOR EQUIPMENT FOR CMP FOR PREVENTING SCRATCH AND SCRATCH PREVENTING METHOD THEREOF TO SOLIDIFY FOREIGN SUBSTANCES LIKE SOLID SLURRY THAT IS GENERATED DURING POLISHING PROCESS AND IS ATTACHED TO EQUIPMENT WHILE USING COOLING PLATE

摘要

PURPOSE: Semiconductor equipment for a CMP(chemical mechanical polishing) process for preventing a scratch is provided to solidify foreign substances like solid slurry that is generated during a polishing process and is attached to equipment while using a cooling plate by installing the cooling plate in the periphery of a head part wherein an ultra-low temperature material like liquefied nitrogen or liquefied helium passes through the cooling plate. CONSTITUTION: A wafer(230) is placed on a polishing pad capable of being chemical or mechanically polished. A polishing table(200) of a disc type attaches the polishing pad. A head(220) supports the wafer. Slurry(310) of a liquid state is injected to the surface of the polishing pad through a slurry injection hole(240). A slurry attach plate(260) attaches particles including the slurry.