| 摘要 |
PURPOSE: A high-reliability chip scale package is provided to increase throughput and eliminate the necessity of a new fabricating machine by attaching a high-reliability solder ball that is coherent and inexpensive. CONSTITUTION: A substrate is prepared, including a patterned metal layer, the first insulation layer and the second insulation layer. The patterned metal layer has the first surface, the second surface and an opening extending between the first and second surfaces. The first insulation layer extends to the opening to make the first insulation layer in the opening have the same plane as the second surface, covering the first surface. A part of the second surface of the patterned metal layer and the opening are covered with the second insulation layer. An integrated circuit chip(206) has active and passive surfaces, and the passive surface is attached to the first insulation layer. The integrated circuit chip is covered with a plastic capsulation material. |
