发明名称 MOLD FOR MANUFACTURING BUFFERING COVERS, CONCERNED WITH MINIMIZING PAINS A USER FEEL WHEN USING EARPHONE AND AMPLIFYING SOUND
摘要 PURPOSE: A mold for manufacturing buffering covers is provided to amplify sound by using a vibrating space of a speaker and to reduce pains a user feel when using an earphone by buffering the vibrating force. CONSTITUTION: A mold for manufacturing buffering covers includes an inner mold(100), an upper mold(200), and a lower mold(300). The inner mold includes the first mold(110), the second mold(130) having a lower portion attached to the first mold, and a core attached to an edge of the second mold. The inner mold is formed to include an oil path from an interface of the first and second molds to an edge of the first mold. The upper mold is coupled with the first attachment surface and includes a core insertion hole(230) for extending the oil path to an edge of the core. The lower mold includes an oil path forming hole(330), for extending the oil path to a lower edge of the second mold, and a mold ejecting hole(320) coupled with the oil path forming hole.
申请公布号 KR20050014375(A) 申请公布日期 2005.02.07
申请号 KR20030052977 申请日期 2003.07.31
申请人 SPLENDOR CORPORATION 发明人 CHOI, YOUNG JUN
分类号 H04R1/02;H04R25/00;(IPC1-7):H04R1/02 主分类号 H04R1/02
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