LEAD FRAME AND SEMICONDUCTOR PACKAGE EQUIPPED WITH THE SAME FOR INCREASING NUMBER OF LEADS

摘要

PURPOSE: A lead frame and a semiconductor package equipped with the same are provided to increase the number of leads by supporting a pad without using a tie bar or a fuse lead. CONSTITUTION: A semiconductor chip is loaded on a pad(41). A plurality of leads(42) are arranged around the pad and extends to the radiative direction. A connection bar(45) extends from one side of the pad through a gap between two adjacent leads of the leads. The leads has the same pitch. A dam bar(43) is formed at an end part of the lead. The connection bar extends to the radiative direction through an end part of the dam bar.