SEMICONDUCTOR CHIP PACKAGE AND STACKED MODULE THEREOF HAVING FUNCTIONAL PART AND PACKAGING PART ARRANGED SIDEWAYS ON ONE PLANE TO ADVANTAGEOUSLY FORM ULTRA-THIN PACKAGE AND DECREASE THERMAL STRESS CAPABLE OF OCCURRING BETWEEN CONSTITUTION ELEMENTS WITH DIFFERENT THERMAL EXPANSION COEFFICIENTS IN SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: A semiconductor chip package and a stacked module thereof having a functional part and a packaging part arranged sideways on one plane is provided to advantageously form an ultra-thin package by decreasing the entire height of a semiconductor chip package, and to decrease thermal stress capable of occurring between constitution elements with different thermal expansion coefficients in the semiconductor chip package by forming the constitution elements in mutually different regions. CONSTITUTION: The first circuit board(102) has the first and second regions(102A,102B) that are divided on the same plane according to a length direction, including the first surface(104) extending across the first and second regions and the second surface(106) opposite to the first surface. A semiconductor chip(110) is mounted on the first region on the first surface. A mounting member is formed on the second region on the first surface to electrically connect the semiconductor chip to an outer terminal.