发明名称 PLASMA PROCESS APPARATUS AND CLEANING METHOD THEREOF TO REDUCE FABRICATING COST
摘要 PURPOSE: A plasma process apparatus is provided to reduce fabricating cost, by eliminating ion bombardment of a substrate to be processed, by improving the quality of a layer and by efficiently removing the particles in a process chamber. CONSTITUTION: A process chamber is prepared. A substrate maintaining part(23) maintains a substrate(4) to be processes, installed in the process chamber. A composite electrode(28) has a plurality of discharge electrodes for generating plasma, installed in the process chamber and confronting the substrate maintaining part. A material gas supply part supplies material gas to the inside of the process chamber. A plasma region increasing/decreasing part(21) increases/decreases a plasma region formed in the process chamber. A cleaning part cleans the inside of the process chamber by using plasma of the plasma region increased or decreased by the plasma region increasing/decreasing part.
申请公布号 KR20050014715(A) 申请公布日期 2005.02.07
申请号 KR20040059722 申请日期 2004.07.29
申请人 SHARP CORPORATION 发明人 HATANO, AKITSUGU
分类号 H05H1/46;C23C16/00;C23C16/44;C23C16/509;H01L21/00;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):H01L21/302 主分类号 H05H1/46
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