发明名称 |
PLASMA ETCHING APPARATUS FOR CONTROLLING PROPERLY INTENSITY OF RF ELECTRIC FIELD AND IMPROVING ETCHING UNIFORMITY |
摘要 |
PURPOSE: A plasma etching apparatus is provided to control properly intensity of RF electric field and improve etching uniformity by adjusting a shape of an upper electrode to form a discontinuous interval between opposite sides of the upper electrode and a lower electrode. CONSTITUTION: An upper electrode(25) is opposite to a lower electrode(23). A substrate(24) is arranged on the lower substrate. An RF generator is used for generating plasma by applying an RF voltage to one of the upper electrode and the lower electrode. An interval between opposite sides of the upper electrode and the lower electrode is discontinuously formed by adjusting a shape of the upper electrode.
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申请公布号 |
KR20050013734(A) |
申请公布日期 |
2005.02.05 |
申请号 |
KR20030052285 |
申请日期 |
2003.07.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO, HYUNG CHUL;HAN, SANG CHUL;JEON, SANG JEAN;KWON, TAE YONG |
分类号 |
H05H1/46;H01J37/32;H01L21/3065;(IPC1-7):H01L21/306 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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