发明名称 PLASMA ETCHING APPARATUS FOR CONTROLLING PROPERLY INTENSITY OF RF ELECTRIC FIELD AND IMPROVING ETCHING UNIFORMITY
摘要 PURPOSE: A plasma etching apparatus is provided to control properly intensity of RF electric field and improve etching uniformity by adjusting a shape of an upper electrode to form a discontinuous interval between opposite sides of the upper electrode and a lower electrode. CONSTITUTION: An upper electrode(25) is opposite to a lower electrode(23). A substrate(24) is arranged on the lower substrate. An RF generator is used for generating plasma by applying an RF voltage to one of the upper electrode and the lower electrode. An interval between opposite sides of the upper electrode and the lower electrode is discontinuously formed by adjusting a shape of the upper electrode.
申请公布号 KR20050013734(A) 申请公布日期 2005.02.05
申请号 KR20030052285 申请日期 2003.07.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO, HYUNG CHUL;HAN, SANG CHUL;JEON, SANG JEAN;KWON, TAE YONG
分类号 H05H1/46;H01J37/32;H01L21/3065;(IPC1-7):H01L21/306 主分类号 H05H1/46
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