PRECISE CROSS-SECTIONAL SAMPLE FABRICATION APPARATUS FOR ANALYZING FAILURE OF DEVICE USING SILICON SUBSTRATE FOR CUTTING ONLY DESIRED PART

摘要

PURPOSE: A precise cross-sectional sample fabrication apparatus for analyzing a failure of a device using a silicon substrate is provided to cut only a desired part by using a cleavage plane characteristic of a silicon wafer to apply stress. CONSTITUTION: A precise cross-sectional sample fabrication apparatus for analyzing a failure of a device using a silicon substrate includes a cutting tip(108) for executing a cutting operation by using a cleavage plane characteristic of the silicon substrate. The precise cross-sectional sample fabrication apparatus further include a cutting handle(106), a microscope barrel(104), a handle(102) for controlling a focus, and a V-groove sample holder(110) having a fixing clip for fixing the silicon substrate.