SOLDER BALL ATTACHMENT APPARATUS OF PERFORMING MIXED PROCESS OF DIFFERENT TYPE SEMICONDUCTOR PACKAGES FOR MAXIMIZING OPERATING RATIO

摘要

PURPOSE: A solder ball attachment apparatus of performing a mixed process of different type semiconductor packages is provided to maximize an operating ratio by processing simultaneously different type semiconductor packages. CONSTITUTION: A magazine loader is used for loading a magazine. A frame transfer part is used for transferring a frame loaded on the magazine. A flux dotter is used for performing a flux treatment for the frame. A solder ball mounter is used for attaching solder balls to the frame. An unloader transfer part is used for transferring the processed frame to an unloader conveyer. A tool control unit controls the magazine loader, the frame transfer part, the flux dotter, the solder ball mounter, and the unloader transfer part. The magazine loader, the frame transfer part, the flux dotter, the solder ball mounter, the unloader transfer part, and the tool control unit have a structure for performing a mixed process of different type semiconductor packages.