发明名称 MEMORY MODULE HAVING HUB TO ACCESS INDIVIDUAL SEMICONDUCTOR MEMORY DEVICE FROM OUTSIDE
摘要 PURPOSE: A memory module having a hub to access an individual semiconductor memory device from the outside is provided to test the individual semiconductor memory device by accessing the individual semiconductor memory device forming the memory module from the outside. CONSTITUTION: The DRAMs(32,33) store data and output the stored data by mounting on a module substrate(34). The hub(31) functions as a path for signal transfer between the outside of the module and the DRAMs by mounting on the module substrate. An I/O(Input/Output) tap(IO TAP) functions as a signal I/O path between the hub and the outside of the module by mounting on the module substrate. The first memory tap(C/A TAP) functions a command/address I/O path between the DRAMs and the outside by mounting on the module substrate. The second memory tap(DQ TAP) functions a data I/O path between the DRAMs and the outside by mounting on the module substrate.
申请公布号 KR20050013455(A) 申请公布日期 2005.02.04
申请号 KR20030052112 申请日期 2003.07.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN, YOUNG MAN;MUN, SEUNG HEE;SEO, SEUNG JIN;SO, BYUNG SE
分类号 G06F13/16;(IPC1-7):G06F13/16 主分类号 G06F13/16
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