Substrate cavity zones filling method for fabricating printed circuit, involves replacing gas evacuated in form of bubbles by viscous product, and adjusting thickness of product or scraping of excess product at substrate surface

摘要

The method involves setting a viscous product at the level of cavity zones (4) to evacuate gas present in the zones in the form of bubbles. The evacuated gas is replaced by the product. Thickness of the product or scraping of excess product is adjusted on a surface of a substrate (1) such that the product constantly remains in contact with the zone from the beginning of filling until the scraping of excess product. An independent claim is also included for equipment associated with a device for filling cavity zones with respect to the surface of a substrate without serigraphy mask or screen.