| 摘要 |
PURPOSE: A bonding apparatus for bonding an anisotropic conductive film and a circuit board in a flat panel display is provided to improve bonding quality and efficiency in work processes by making the film and the circuit board easily bonded onto glass by using one equipment. CONSTITUTION: A film bonding part(4) installed on a work stand(2) bonds an anisotropic conductive film(F) onto glass(G). A circuit board bonding part(6) sets and bonds a circuit board(B) on the glass at the work stand. The film bonding part includes a turn table(T1) rotatably installed at the work stand, a loading state(12) which is installed at the turn table and loads the glass and a film bonding unit(14) for bonding the film onto the glass. The circuit board bonding part includes a turn table(T2), a loading unit(24) for loading the glass, a setting unit(26) for setting the circuit board on the loaded glass and a board bonding unit(28) for bonding the set circuit board onto the glass.
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